1. MATERIAL：FR4, High Tg FR4, Lead free (PN)FR4,Halogen free FR4, CEM3, CEM1, Etc.
2. MIN LINE WIDTH/SPACING：0.003”/0.003”(0.075mm/0.075mm)
3. MIN HOLE SIZE：0.004”(0.10mm)(Mech.drill), 0.003”(0.075mm)(Laser drill)
4. MAX ASPECT RATIO： 8.0
5. BOARD THICKNESS： 0.010”~0.125”(0.25mm~3.12mm)
6. MIN SMD PITCH：0.012”(0.30mm)
7. LAYER COUNTS：1~16 Layers
8. FINISHED COPPER THICKNESS：0.5~4Oz
9. SOLDRMASK COLOR：Green, Blue, Red, Yellow, white, Black.
10.LEGEND COLOR：White, Yellow, Black.
11.FINISHED SURFACE：ENIG, HAL Leadfree, Fully Hard gold/Soft gold plating, OSP, Immersion Tin.
12.WARP AND TWIST：0.7% Max
13.IMPEDANCE CONTROL TOLERANCE：+/-10%
14.MAX BOARD SIZE：550x650mm
15.MIN BOARD THICKNESS：2L-0.2±0.10mm
4L-0.4±0.10mm
6L-0.6±0.10mm
8L-1.0±0.10mm
10L-1.0±0.10mm
12L-1.2±0.12mm
16.MIN SOLDER DAM：2.5mil (MIN SMT Pad Space 5mil)
17.MIN CONTOUR TOLERANCE：+/-0.075mm
18.V-CUT WEB TOLERANCE：+/-0.080MM
1. MATERIAL：FR4, High Tg FR4, Lead free (PN)FR4,Halogen free FR4, CEM3, CEM1, Etc.
2. MIN LINE WIDTH/SPACING：0.003”/0.003”(0.075mm/0.075mm)
3. MIN HOLE SIZE：0.004”(0.10mm)(Mech.drill), 0.003”(0.075mm)(Laser drill)
4. MAX ASPECT RATIO： 8.0
5. BOARD THICKNESS： 0.010”~0.125”(0.25mm~3.12mm)
6. MIN SMD PITCH：0.012”(0.30mm)
7. LAYER COUNTS：1~16 Layers
8. FINISHED COPPER THICKNESS：0.5~4Oz
9. SOLDRMASK COLOR：Green, Blue, Red, Yellow, white, Black.
10.LEGEND COLOR：White, Yellow, Black.
11.FINISHED SURFACE：ENIG, HAL Leadfree, Fully Hard gold/Soft gold plating, OSP, Immersion Tin.
12.WARP AND TWIST：0.7% Max
13.IMPEDANCE CONTROL TOLERANCE：+/-10%
14.MAX BOARD SIZE：550x650mm
15.MIN BOARD THICKNESS：2L-0.2±0.10mm
4L-0.4±0.10mm
6L-0.6±0.10mm
8L-1.0±0.10mm
10L-1.0±0.10mm
12L-1.2±0.12mm
16.MIN SOLDER DAM：2.5mil (MIN SMT Pad Space 5mil)
17.MIN CONTOUR TOLERANCE：+/-0.075mm
18.V-CUT WEB TOLERANCE：+/-0.080MM